Wafer_Frame_Box
Product Details
Spring design in the upper cover can effectively avoid the flex frame movement,prevent wafer breakage,minimize particle generation.
Structural strengthening design can effectively increase product impact strength and life.
Lightweight design reduces manufacturing and transportation costs.
Provide Ultra Clean PP and Antistatic PP materials for customer.
| Wafer Size | Material | Surface Resistance | Internal Diameter |
| 6″（150mm） | Ultra Clean PP | N/A | 150mm |
| 6″（150mm） | Antistatic PP | 10E4Ω-10E11Ω | 150mm |
| 8″（200mm） | Ultra Clean PP | N/A | 200mm |
| 8″（200mm） | Antistatic PP | 10E4Ω-10E11Ω | 200mm |
| 12″（300mm） | Ultra Clean PP | N/A | 300mm |
| 12″（300mm） | Antistatic PP | 10E4Ω-10E11Ω | 300mm |
