ESD_Wafer_Foam_Separator
Product Details
The innovative shock absorption design replaces the original foam material to avoid corrosion and organic contamination.
The inner Packing height of the packing box can be controlled by choosing different thickness of the sponge pad and IC spacer.
Excellent ESD property, good shockproof property, Eliminating organic contamination.
| Wafer Size | Material | Surface Resistance | Internal Diameter | Thickness |
| 4″（100mm） | Antistatic Foam | 10E6Ω-10E11Ω | 100mm | 3-6mm |
| 5″（125mm） | Antistatic Foam | 10E6Ω-10E11Ω | 125mm | 3-6mm |
| 6″（150mm） | Antistatic Foam | 10E6Ω-10E11Ω | 150mm | 3-6mm |
| 8″ （200mm） | Antistatic Foam | 10E6Ω-10E11Ω | 200mm | 3-6mm |
12″（300mm） |
Antistatic Foam | 10E6Ω-10E11Ω | 300mm | 3-6mm |
