Hoop_Ring
Product Details
Double sided design to ensure the operation is simple and quick.
The ring separator only contacts wafer periphery to ensure no scratches on the wafer surface and provide effective protection during wafer transportation.
Surface etching design of the ring separator to effectively avoid adhesion to the wafer.
| Wafer Size | Material | Surface Resistance | Internal Diameter | Thickness |
| 6″ （150mm） | Antistatic PP | 10E4Ω-10E11Ω | 150mm | 1.2mm |
| 8″ （200mm） | Antistatic PP | 10E4Ω-10E11Ω | 200mm | 1.2mm |
| 12″（300mm） | Antistatic PP | 10E4Ω-10E11Ω | 300mm | 3.5mm |
