Product Details
Spring design inside the upper cover can effectively avoid the wafer rotation,prevent wafer breakage, minimize particle generation.
The combination design can effectively prevent the movement inside the slot during transportation and provide effective protection for wafer transportation process.
It can effectively reduce the weight of products while optimizing the product design.
The design conforms to the automatic interface of process equipment.
Wafer Size |
Material |
Surface Resistance |
Internal Diameter |
3″
(75mm) |
Ultra Clean PP |
N/A |
75mm |
4″
(100mm) |
Ultra Clean PP |
N/A |
100mm |
6″
(150mm) |
Ultra Clean PP |
N/A |
150mm |
8″
(200mm) |
Ultra Clean PP |
N/A |
200mm |
